Application of magnetron sputtering

Application of magnetron sputtering

Magnetron sputtering is the most efficient method for low temperature deposition in PVD technology. During magnetron sputtering, the electrons are absorbed by the dark field cover or the specially attached anode, and the temperature of the obtained substrate is lower than that of traditional sputtering. Other temperature sensitive materials are deposited as substrates. In 1998, Teel Coating Ltd. proposed the technology of depositing high-quality TiN and TiCN coatings by magnetron sputtering at low temperature, and the substrate temperature could be lowered to less than 70 °C, thus expanding the possible application range of similar coatings. In recent years, Loughborough University in the United Kingdom has successfully reduced the substrate temperature during magnetron sputtering from 350 to 500 °C to about 150 °C at room temperature, and successfully applied TiN and CrN coatings to artificial tooth mold surfaces and copper The surface of the welding contact head increases its service life by 5 to 10 times. It can be seen that the research on low temperature deposition methods and processes is very meaningful and promising.