Common knowledge of vacuum coating magnetron sputtering- Ningbo Danko Vacuum Technology Co., Ltd.

Common knowledge of vacuum coating magnetron sputtering

DC Magnetron Sputtering, RF Magnetron Sputtering, Pulsed Magnetron Sputtering and Medium Fre2quency Magnetron Sputtering

Reactive sputtering is to introduce a certain proportion of reactive gas into the inert gas atmosphere in the sputtering system. Usually, the main reactive gases are oxygen and nitrogen.

The DC sputtering method is used in sputtering and reactive sputtering coating where the sputtered material is a conductive material, and the process equipment is simple and has a high sputtering rate.

In a single cathode target system, medium frequency AC magnetron sputtering has the same charge release and arc prevention effect as pulse magnetron sputtering. The medium frequency AC sputtering technology is also applied to the twin target (Twin2Mag) sputtering system. The medium frequency AC twin target sputtering is to connect the two output ends of the medium frequency AC power supply to the respective cathodes of the closed magnetic field unbalanced sputtering double target. Therefore, alternating voltages with opposite phases are respectively obtained on the double targets, and a pair of magnetron sputtering targets alternately become cathodes and anodes.

The twin target sputtering technology greatly improves the stability of the magnetron sputtering operation, which can avoid the accumulation of charges on the poisoned target surface, causing the problem of arc ignition on the target surface and the disappearance of the anode. Lay the foundation for mass production.

Magnetron Sputtering Coating Machine

Multi-arc ion & sputtering coatings can be deposited in a wide range of colors. The rang of colors can be further enhanced by introducing reactive gases into the chamber during the deposition process. The widely used reactive gases for decorative coatings are nitrogen, oxygen, argon or acetylene. The decorative coatings are produced in a certain color range, depending on the metal-to-gas ratio in the coating and the structure of the coating. Both of these factors can be altered by changing the deposition parameters.

Prior to deposition, the parts are cleaned so the surface is free of dust or chemical impurities. Once the coating process has started, all the relevant process parameters are continuously monitored and controlled by an automatic computer control system.