Magnetron Sputtering Vacuum Coating Machine

A magnetron sputtering vacuum coating system uses high-energy ions to deposit a thin layer of material onto a substrate. The process is quick and inexpensive, and produces a high-purity coating. High-energy ions are released from a source material and collide with an inert gas, such as Argon. These ions produce a plasma and atoms of the source material are ejected.

Magnetron sputtering vacuum-coating machine is commonly used in jewelry manufacturing. Its rotary and stationary designs can be easily adjusted to meet a wide variety of coating requirements. This machine is suitable for coating any metal or non-metallic substrate. It can also be used to coat plastic, ceramic, and crystal glass. Its high-end features include good uniformity and fast deposition rates.

A magnetron sputtering vacuum coating system is a powerful and versatile tool for high-volume production. Depending on the needs and application, this technique can create thin films with a wide range of desired properties. Different power systems, materials, and gases can be used to optimize the process. Before the process begins, the substrate is mounted into the holder. The holder then passes through a load lock chamber to prevent it from moving.

This vacuum coating system is a low-cost method that produces high-quality coatings with a high percent of pass rate. It is ideal for aviation and high-end electronics manufacturing. It can also be used for alloy plating and composite metal films. This is an economical and effective way to coat many types of materials.

A magnetron sputtering vacuum coating system uses a sputtering source that takes advantage of electron confinement. The magnets trap electrons on the surface of the target, resulting in a higher plasma density and higher deposition rates. Unlike conventional sputtering methods, this technique is safe and does not cause damage to the coating object.

The sputtering gas used in the process is an important consideration. The type of gas to use depends on the atomic weight of the substrate. For example, lighter materials benefit from the use of neon or xenon. If the chamber contains oxygen, the process will be reactive.

The sputtering process involves exposing the target material to reactive gases. These gases react with the target material and create a molecular compound. The material is then deposited as a thin film coating. For example, when a silicon target is reactively sputtered with oxygen or nitrogen, it produces silicon oxide or silicon nitride. This method is often used to coat multiple materials simultaneously.

Magnetron Sputtering Coating Machine

Multi-arc ion & sputtering coatings can be deposited in a wide range of colors. The rang of colors can be further enhanced by introducing reactive gases into the chamber during the deposition process. The widely used reactive gases for decorative coatings are nitrogen, oxygen, argon or acetylene. The decorative coatings are produced in a certain color range, depending on the metal-to-gas ratio in the coating and the structure of the coating. Both of these factors can be altered by changing the deposition parameters.

Prior to deposition, the parts are cleaned so the surface is free of dust or chemical impurities. Once the coating process has started, all the relevant process parameters are continuously monitored and controlled by an automatic computer control system.

• Substrate Material: Glass, Metal (carbon steel, stainless steel, brass),Ceramics, Plastic, Jewelry.

• Structure Type: Vertical structure, #304 Stainless Steel.

• Coating Film: Multi-functional metal film, composite film, transparent conductive film, reflectance-increasing film, electromagnetic shielding film, decorative film.

• Film Color: multi colors, gun black, titanium golden color, rose golden color, stainless steel color, purple color, dark black, dark blue and other more colors.

• Film type: TiN, CrN, ZrN, TiCN, TiCrN, TiNC, TiALN and DLC.

• Consumables in production: Titanium, Chromium, Zirconium, Iron, alloy target; plane target, cylindrical target, twin target, opposite target.